Developing Metalization Process for Homemade Microelectronics

(Click on image to enlarge)

Progress in developing the metalization process for the home chip lab. DC and RF sputtering is used and the process will be refined more and then I will move on to the wet process with etching metal through resist mask, etc.

Sputtering Setup

Sample is scratched with a razor and surface roughness is measured with a KLA Tencor Stylus Profiler. Surface is extremely rough and best interpretation of the data leads me to believe the thickness of the sputtered film is approximately 0.492um.

DC Sputtering
DC Sputtering

Leave a Reply

Your email address will not be published. Required fields are marked *