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Progress in developing the metalization process for the home chip lab. DC and RF sputtering is used and the process will be refined more and then I will move on to the wet process with etching metal through resist mask, etc.
Sample is scratched with a razor and surface roughness is measured with a KLA Tencor Stylus Profiler. Surface is extremely rough and best interpretation of the data leads me to believe the thickness of the sputtered film is approximately 0.492um.
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