Thin films of copper were prepared on non-conductive samples to be observed under the Electron Microscope. This process is called DC Diode Sputtering and took place at just below 100mTorr and 2000v @ 150watts.
This same setup can be used at lower powers to plasma clean or etch the top layer surface of the sample for better images under the SEM. Oxygen (and sometimes a small amount of Nitrogen) is usually a much more effective gas for this cleaning than Argon and leads to less unwanted sputtering as well.
Sputtering system v2 was made to support DC and RF sputtering so I can make dielectric coatings as well and it supports larger target and substrate samples. An insulator will be constructed to mount the target holder to the main chamber walls so that RF can be used more effectively.
A huge thanks to David Bono from the DMSE UGTL lab at MIT for training me in basic SEM operation during a recent college visit on MIT’s JEOL JSM-6400, which is very similar to my JSM-6300. Because of David Bono and Colin Marcus’s generosity I was able to get my SEM up and running.
You can see the opened specimen stage of my SEM in these pictures, notice the backscattered electron detector in the center of the coulumn in the second picture and the faraday cage on the right. The faraday cage is positively biased to attract secondary electrons to it and into the scintillator.