Thermal evaporation deposition of Al from Tungsten boat at 5.5×10^-6 Torr and around 200 amps. Aluminum alloys with Tungsten at the high temperature and causes boat failure, a thicker gauge boat will be used in the future or one made of TiB2-BN or BN.
Approx. deposition rate throughout the run was 2.2nm/s, with total accumulation of 0.5um. Much faster than my sputtering setup but yields a far worse film.
Aluminum is deposited through tin foil shadow mask onto Si wafer as a test.
Power was from a rewound MOT, current limited by resistance of copper feedthrough and connections to W boat.